Press Releases - Current
June 15, 2009
Staccato announces the appointment of Andreas Melder who will lead worldwide marketing and business development efforts for the company.
February 20, 2009
The State of UWB and Predictions for 2009
A lot has been written over the past several months regarding the state of UWB. The flurry really started in October of last year with the news of WiQuest shutting its doors, and leading up to the recent news of TZero, another UWB start-up, running out of funding.
February 3, 2009
Staccato Achieves WiMedia Certification Milestones
Ripcord2™ single-chip UWB solution earns WiMedia platform certification for recently ratified Spectrum Extension Release; Ripcord A-200™ earns WiMedia PHY certification for Band Groups 1, 3 and 6
January 7, 2009
Imation Selects Staccato Wireless USB Solution for Wireless Projection Link
Staccato Ripcord Zero Install™ solution powers true ‘plug and play’ experience for digital projectors
December 18, 2008
Staccato Expands Into India; Acquires WiQuest Design Center of Excellence
Solidifying Staccato’s industry leadership, Bangalore design team adds deep knowledge and development expertise in UWB and Wireless USB technology
December 15, 2008
Milestone achievement for industry’s first and only single-chip 65nm CMOS implementation demonstrates Staccato’s commitment to delivering standards-compliant, worldwide-compatible products for volume markets.
November 20, 2008
Staccato Announces Merger with Artimi and Secures New Financing
Merger and funding enable combined company to productize an integrated portfolio of best-in-class solutions for UWB and Wireless USB applications
November 12, 2008
Staccato’s Ripcord2™ Named 2009 International CES Best Enabling Technology
Staccato awarded “Best of Innovations” honors in the Enabling Technology category and as a Design and Engineering honoree
November 10, 2008
Staccato Unveils High-Performance, Single-Chip Wireless USB Host Solution for Worldwide Operation
New addition to Ripcord2™ family supports PCI Express interface and is the first and only single-chip solution to achieve WiMedia PHY certification in Band Groups 1, 3 and 6
November 4, 2008
Enabling worldwide operation, Staccato’s 65nm all-CMOS implementation is the first and only single-chip solution to earn PHY certification for WiMedia Spectrum Extension Release (SER) in Band Groups 1, 3 and 6
October 21, 2008
Cadence Helps Staccato Launch Ripcord2™ Single-Chip, Ultra-Wideband IC Family
Staccato Utilizes Cadence Low-Power Solution to Achieve Leading Power Consumption with Reduced Design Risk
September 29, 2008
CONNECT Announces 2008 Finalists
September 2, 2008
Staccato Introduces Ripcord2 Single-Chip, Ultra-Wideband IC Family
Industry’s first 65nm all-CMOS implementation sets new bar for power, size, performance and integration.
July 18, 2008
Staccato Communications and Silicon Technology Enter Into Distribution Agreement for Japan
Leading Japanese distributor selected to represent Staccato’s Ripcord® family of single-chip, all-CMOS WiMedia Ultra Wideband products
March 17, 2008
Staccato Delivers Certified Wireless USB Native Device Development Kit
Based on the Ripcord1™ Certified Single-Chip, All-CMOS Solution, Staccato’s New Development Kit Reduces Design Complexity and Accelerates Time-to-Market for Embedded Designs
November 14, 2007
Staccato’s Ripcord™ SC3500 is the industry’s first certified single-chip; Staccato is enabling Wireless USB for the masses with affordable, interoperable, low power and small form-factor solutions.
October 8, 2007
Staccato Achieves WiMedia Platform Certification and Secures Additional Funding
Enabling Interoperability with Multiple Vendors, Staccato’s Ripcord™ Family is the First Single-Chip, All-CMOS Ultra Wideband Solution with Multi-Protocol Support to Earn Platform Certification
July 23, 2007
The industry’s first and only single-chip, all-CMOS product family, Ripcord™ secures US FCC and Japanese TELEC regulatory approval, enabling faster time-to-market with reduced risk for customers
January 8, 2007
New single-chip, all-CMOS Ripcord™ Chip Scale Package reduces the space required to implement UWB in mobile products by 70%